Call for Research Papers

Exploring the interplay between AI/ML and System Engineering

We welcome submissions presenting original research that explores the interplay between AI/ML and system engineering. Our focus includes (but is not limited to) the following pivotal topics:

01

Scalable & Efficient AI-ML

Focuses on agentic AI systems, AIOps efficiency, and distributed, federated, or decentralized learning. Topics include high-performance, robust, secure, and energy-efficient systems, as well as root-cause analysis and auto-scaling for deployments on-premise, in the cloud, or at the edge.

02

System Architectures

Advanced hardware platforms (CPU, GPU, accelerators, edge devices) enabling improved cost, performance, and power efficiency; high-performance computing for AI workloads; custom hardware co-design; and data-intensive infrastructures.

03

Socio-Economic & Decision Systems

Vertical and domain-adapted foundation models, agentic workflows, and emerging AI techniques with significant system-level implications for decision making and socio-economic modeling.

04

Domain-Specific Solutions

Advanced AI-ML methods for real-world systems including healthcare, education, governance, finance, communication, security, and computer vision. Emphasis is placed on scalability, robustness, and meeting strict operational constraints.

05

Safe & Responsible AI

Safe system design, detection of out-of-distribution data and hallucinations, and rigorous verification and testing of AI systems. Includes the analysis of risks and opportunities arising from real-world deployment.

Important Dates

June 15, 2026 June 22, 2026
Paper Submissions Due
Strictly Final Deadline No further extensions will be granted.
July 30, 2026 Author Notifications
Aug 31, 2026 Camera Ready Deadline
Oct 6-9, 2026 Conference Dates

All deadlines are 11:59 pm AoE.

Submission Guidelines

  • Page Limit: Must not exceed 8 pages + references for regular papers, and 4 pages for short papers. No appendix nor supplementary material is allowed.
  • Format: Double-column IEEE Format.
  • Review: Double-blind review process.

For queries, contact the TPC Co-Chairs

Filippo Maria Bianchi

UiT, Norway

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Fazel Keshtkar

St John’s University, USA

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Kalika Bali

Microsoft, India

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